EC-1850FT-LV
Thermal Potting Compound
EC-1850FT-LV
EC-1850FT-LV is a pourable filled epoxy resin system offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. It is a lower viscosity version of EC-1850FT. It rapidly transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low shrinkage minimizes risk of damage to fragile components. It is useful for potting and encapsulating densely packaged power supplies and heat generating components, integrated circuits, power and operational amplifiers, transformers and many types of semiconductors.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100:3.5 (with EH-9) |
| Mixed Viscosity @RT(cps) | 4000-8000 (with EH-9) |
| Pot Life @25°C(100 gram) | 40-60 min |
| Recommended Cure | 2 hours @ 70°C |
| Alternate Cure | 24 hours @ 25°C |
| Color | Black |
| Specific Gravity | 2.3 |
| Hardness(Shore) | D-94 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | 2400 |
| Tg(°C) | 86 |
| CTE(Below Tg)10-6/°C | 26 |
| Service Temp.Range | -55°C - 150°C |
| Thermal Conductivity(W/m°K) | 1.53 |
| Volume Resistivity(500 V) | 2 x 10^15 |
Recommended Applications
- Equipment modules
- Power supplies
- Relays and amplifiers
- Transformers
- Coils and ferrite cores
- Coil Winding Impregnation
- Encapsulation of circuit boards
Use the form below to request additional information & product data
