EO-20E
EO-20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip
bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity.
EO-20E is low viscosity but thixotropic nature makes it ideal for screen printing and die attach applications. It can be cured in less than 1 minute at 175°C. In opto-electronic packaging applications, EO-20E is used to die attached LED chips to substrates in single chip packages or arrays. EO-20E meets NASA outgassing standards when cured properly and can be used in Rf and EMI shielding applications.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 1:1 |
| Mixed Viscosity @RT(cps) | 2000-4000 |
| Pot Life @25°C(100 gram) | >2 days |
| Recommended Cure | 5 min @ 150°C |
| Alternate Cure | 2 hrs @ 100°C |
| Color | Silver |
| Specific Gravity | 2.70 |
| Hardness(Shore) | D-75 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | 1400 |
| Tg(°C) | 110 |
| CTE(Below Tg)10-6/°C | 30 |
| Service Temp.Range | -55°C to 200°C |
| Thermal Conductivity(W/m°K) | 2.5 |
| Volume Resistivity(500 V) | 0.0004 |
Recommended Applications
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