EO-20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip
bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity.

EO-20E is low viscosity but thixotropic nature makes it ideal for screen printing and die attach applications. It can be cured in less than 1 minute at 175°C. In opto-electronic packaging applications, EO-20E is used to die attached LED chips to substrates in single chip packages or arrays. EO-20E meets NASA outgassing standards when cured properly and can be used in Rf and EMI shielding applications.

Product Specifications

No.of Components 2
Mix Ratio by Weight 1:1
Mixed Viscosity @RT(cps) 2000-4000
Pot Life @25°C(100 gram) >2 days
Recommended Cure 5 min @ 150°C
Alternate Cure 2 hrs @ 100°C
Color Silver
Specific Gravity 2.70
Hardness(Shore) D-75
Refractive Index NA
Lap Shear Strength @25°C(psi) 1400
Tg(°C) 110
CTE(Below Tg)10-6/°C 30
Service Temp.Range -55°C to 200°C
Thermal Conductivity(W/m°K) 2.5
Volume Resistivity(500 V) 0.0004

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