EO-20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip
bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity.
EO-20E is low viscosity but thixotropic nature makes it ideal for screen printing and die attach applications. It can be cured in less than 1 minute at 175°C. In opto-electronic packaging applications, EO-20E is used to die attached LED chips to substrates in single chip packages or arrays. EO-24 meets NASA outgassing standards when cured properly and can be used in Rf and EMI shielding applications.
|Mix Ratio by Weight||1:1|
|Mixed Viscosity @RT(cps)||2000-4000|
|Pot Life @25°C(100 gram)||>2 days|
|Recommended Cure||5 min @ 150°C|
|Alternate Cure||2 hrs @ 100°C|
|Lap Shear Strength @25°C(psi)||1400|
|Service Temp.Range||-55°C to 200°C|
|Volume Resistivity(500 V)||0.0004|
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