HTG-74 is a high temperature resistance thermal grease, highly filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 250°C, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
This material will not bleed, dry, harden or melt in normal industrial use and provides long-term material stability. It can be used for mounting semiconductor devices, power transistors, and diodes; coupling heat generating assemblies to chassis; heat transfer medium on ballast; thermal joints; and many electronics, automotive and electrical applications.
|Mix Ratio by Weight|
|Mixed Viscosity @RT(cps)|
|Pot Life @25°C(100 gram)|
|Lap Shear Strength @25°C(psi)|
|Service Temp.Range||-40°C - 250°C|
|Volume Resistivity(500 V)||1.6 x 10^14|
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