Thermally Conductive Potting

Sc 454m 6 jpg


SC-454M-6 is a thermally conductive, low viscosity, condensation cure, RTV silicone potting or encapsulating compound. It is readily pourable and can cure at room temperature. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.

SC-454M-6 is designed for potting and encapsulation of electrical/electronics components that require the dissipation of heat and the high temperature properties and low stress of a silicone compound. The cured material may be knife-cut for replacement of components and new compound may be poured in place and cured to re-form tight seal.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100:4
Mixed Viscosity @RT(cps) 4,000-6,000
Pot Life @25°C(100 gram) 30-60 min
Recommended Cure 24 hrs @ 25°C
Alternate Cure
Color Red
Specific Gravity 2.2
Hardness(Shore) A-70
Refractive Index NA
Lap Shear Strength @25°C(psi) NA
Tg(°C) NA
CTE(Below Tg)10-6/°C 155
Service Temp.Range -55°C-250°C
Thermal Conductivity(W/m°K) 1.4
Volume Resistivity(500 V) 6.0 x 10^14

Recommended Applications

Use the form below to request additional information & product data