SC-454M-6 is a thermally conductive, low viscosity, condensation cure, RTV silicone potting or encapsulating compound. It is readily pourable and can cure at room temperature. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.
SC-454M-6 is designed for potting and encapsulation of electrical/electronics components that require the dissipation of heat and the high temperature properties and low stress of a silicone compound. The cured material may be knife-cut for replacement of components and new compound may be poured in place and cured to re-form tight seal.
|Mix Ratio by Weight|
|Mixed Viscosity @RT(cps)|
|Pot Life @25°C(100 gram)|
|Lap Shear Strength @25°C(psi)|
|Volume Resistivity(500 V)|
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