SC-454M-6

CONDUCTIVE RTV SILICONE POTTING COMPOUND

SC-454M-6

SC-454M-6 is a thermally conductive, low viscosity, condensation cure, RTV silicone potting or encapsulating compound. It is readily pourable and can cure at room temperature. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.

SC-454M-6 is designed for potting and encapsulation of electrical/electronics components that require the dissipation of heat and the high temperature properties and low stress of a silicone compound. The cured material may be knife-cut for replacement of components and new compound may be poured in place and cured to re-form tight seal.

Product Specifications

No.of Components
Mix Ratio by Weight
Mixed Viscosity @RT(cps)
Pot Life @25°C(100 gram)
Recommended Cure
Alternate Cure
Color
Specific Gravity
Hardness(Shore)
Refractive Index
Lap Shear Strength @25°C(psi)
Tg(°C)
CTE(Below Tg)10-6/°C
Service Temp.Range
Thermal Conductivity(W/m°K)
Volume Resistivity(500 V)

Recommended Applications

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