UV-5403S Smart Card Encapsulation Epoxy
Reliable Epoxy Encapsulation for Smart Cards and Electronics
UV-5403S
UV-5403S is a filled, electronic-grade UV/LED cure epoxy encapsulant engineered for smart card encapsulation and other high-reliability electronic applications. This glob top epoxy features low ionic content (<5 ppm Na⁺, K⁺, Cl⁻), ensuring excellent electrical performance and long-term device reliability.
The product cures rapidly under UV or LED exposure, with an optional secondary heat cure available when required. UV-5403S has been tested to withstand 85°C/85% RH conditions for over 1,000 hours, meeting stringent humidity and thermal stability requirements.
For applications requiring an unfilled epoxy encapsulant, see our companion product UV-8701E.
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | |
| Mixed Viscosity @RT(cps) | 5000-8000 |
| Pot Life @25°C(100 gram) | |
| Recommended Cure | 20-30 seconds @ 320-365nm, Minimum intensity 100 mW/cm |
| Alternate Cure | 10 seconds @ 320-365nm, Intensity 250 mW/cm |
| Color | Off-White |
| Specific Gravity | 1.37 |
| Hardness(Shore) | 75 |
| Refractive Index | |
| Lap Shear Strength @25°C(psi) | 2000 |
| Tg(°C) | 75 |
| CTE(Below Tg)10-6/°C | 40 |
| Service Temp.Range | -50°C to 130°C |
| Thermal Conductivity(W/m°K) | NA |
| Volume Resistivity(500 V) | 1.0x10^16 |
Features & Applications:
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Smart card chip encapsulation for secure and reliable card manufacturing
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General electronic glob top encapsulation for ICs and PCB protection
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Glass assembly bonding with strong adhesion and clarity
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Low-viscosity epoxy for easy dispensing and void-free coverage
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Low ionic content (<5 ppm Na⁺, K⁺, Cl⁻) for improved electrical reliability
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Fast UV/LED cure time with optional secondary heat cure
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