Smart Card Encapsulation Epoxy


UV-5403S is a filled, electronic grade UV and/or LED cure epoxy glob top encapsulant specifically designed for smart card encapsulation. This epoxy glob top has low ionic content (<5ppm Na+, K+, Cl-). This product cures quickly under UV/LED exposure but can have a secondary hear cure if desired. UV-5403S passes stringent 85°C/85% RH testing for over 1000 hours. For an unfilled version, see our UV-8701E.

Product Specifications

No.of Components 1
Mix Ratio by Weight
Mixed Viscosity @RT(cps) 5000-8000
Pot Life @25°C(100 gram)
Recommended Cure 20-30 seconds @ 320-365nm, Minimum intensity 100 mW/cm
Alternate Cure 10 seconds @ 320-365nm, Intensity 250 mW/cm
Color Off-White
Specific Gravity 1.37
Hardness(Shore) 75
Refractive Index
Lap Shear Strength @25°C(psi) 2000
Tg(°C) 75
CTE(Below Tg)10-6/°C 40
Service Temp.Range -50°C to 130°C
Thermal Conductivity(W/m°K) NA
Volume Resistivity(500 V) 1.0x10^16

Features & Applications:

  • Smart Card Chip Encapsulation
  • General electronic glob top
  • Glass Assembly
  • Low Viscosity
  • Low ionic content
  • Fast cure time

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