UV-5403S
Smart Card Encapsulation Epoxy
UV-5403S
UV-5403S is a filled, electronic grade UV and/or LED cure epoxy glob top encapsulant specifically designed for smart card encapsulation. This epoxy glob top has low ionic content (<5ppm Na+, K+, Cl-). This product cures quickly under UV/LED exposure but can have a secondary hear cure if desired. UV-5403S passes stringent 85°C/85% RH testing for over 1000 hours. For an unfilled version, see our UV-8701E.
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | |
| Mixed Viscosity @RT(cps) | 5000-8000 |
| Pot Life @25°C(100 gram) | |
| Recommended Cure | 20-30 seconds @ 320-365nm, Minimum intensity 100 mW/cm |
| Alternate Cure | 10 seconds @ 320-365nm, Intensity 250 mW/cm |
| Color | Off-White |
| Specific Gravity | 1.37 |
| Hardness(Shore) | 75 |
| Refractive Index | |
| Lap Shear Strength @25°C(psi) | 2000 |
| Tg(°C) | 75 |
| CTE(Below Tg)10-6/°C | 40 |
| Service Temp.Range | -50°C to 130°C |
| Thermal Conductivity(W/m°K) | NA |
| Volume Resistivity(500 V) | 1.0x10^16 |
Features & Applications:
- Smart Card Chip Encapsulation
- General electronic glob top
- Glass Assembly
- Low Viscosity
- Low ionic content
- Fast cure time
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