EB-107LP-1 Low-Viscosity Epoxy for Medical and LED Applications
Medical Grade Epoxy
EB-107LP-1
Spectral transmission matters when light must pass cleanly through the epoxy. Common applications include LED light sensors, protective coatings, and potting compounds where visibility of components is critical. If the epoxy does not provide adequate transmission, the result may be dimmer light output or hazy visuals.
EB-107LP-1 is a low-viscosity epoxy system with a mixed viscosity of 100–200 cps. It is USP Class VI certified for biocompatibility and formulated as a non-toxic medical-grade epoxy. Typical medical applications include catheters, ultrasound transducers, dental devices, endoscopic tools, and hand instruments.
Thanks to its extremely low viscosity, EB-107LP-1 is easy to degas, allowing efficient removal of entrapped air. This makes it highly effective as a doming resin for LEDs and also suitable for doming labels, key fobs, magnets, and other small components.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100/25 |
| Mixed Viscosity @RT(cps) | 100-200 |
| Pot Life @25°C(100 gram) | 2 hrs |
| Recommended Cure | 3 hrs @ 65°C |
| Alternate Cure | 24-48 hrs @ 25°C |
| Color | Clear |
| Specific Gravity | 1.1 |
| Hardness(Shore) | D-85 |
| Refractive Index | 1.52 |
| Lap Shear Strength @25°C(psi) | 2400 |
| Tg(°C) | 65 |
| CTE(Below Tg)10-6/°C | 42 |
| Service Temp.Range | -55°C to 200°C |
| Thermal Conductivity(W/m°K) | NA |
| Volume Resistivity(500 V) | >10^13 |
Recommended Applications
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Semiconductor die attach for microelectronics and IC packaging
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Microwave devices and high-frequency electronics
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LCD interconnects and display assembly
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Substrate attach for circuit boards and advanced packaging
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Low-stress bonding for delicate or heat-sensitive components
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Photonic devices including sensors, lasers, and optical components
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