Medical Grade Epoxy

Eb 153 bipax scaled


EB-153 is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100/10
Mixed Viscosity @RT(cps) 3000-5000
Pot Life @25°C(100 gram) 5-6 hours
Recommended Cure 1-2 minutes @ 150°C
Alternate Cure 5-10minutes @ 125°C
Color Dark Amber
Specific Gravity 1.18
Hardness(Shore) D-87
Refractive Index 1.5694 @589nm
Lap Shear Strength @25°C(psi) 2600
Tg(°C) >115
CTE(Below Tg)10-6/°C 54
Service Temp.Range -55°C to 250°C
Thermal Conductivity(W/m°K)
Volume Resistivity(500 V) >1x10^15

Recommended Applications

  • Semiconductor: Wafer to wafer bonding; MEMs devices; flip chip underfill

  • Hybrid: fiber optic, hermetic seals and high temperature packaging sensors

  • Fiber optic: Sealing fiber into ferrules, transmitting light in the optical pathway, Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays

  • Medical: Potting fiber optic bundles into ferrules for light guides and endoscopes; Capable of resisting several sterilization techniques; ISO 10993-5 approved for cytotoxicity; adhesive for catheter devices

  • Electronics Assembly: Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics; Impregnating.

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