EB-350-1LE
ONE COMPONENT EPOXY ADHESIVE & ENCAPSULANT
EB-350-1LE
EB-350-1LE is one part, heat cured epoxy adhesive system. Applications include potting and encapsulating small densely packaged power supplies, integrated circuits, thick film hybrid devices, D/A converters, oscillators, amplifiers, relays, transformers and semiconductors etc.
Fully cured EB-350-1LE provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | NA |
| Mixed Viscosity @RT(cps) | 40,000-60,000 |
| Pot Life @25°C(100 gram) | 20 |
| Recommended Cure | 1 hr @ 80°C+ ½ hr/150°C |
| Alternate Cure | 2 hrs @ 125°C |
| Color | Black |
| Specific Gravity | 1.60 |
| Hardness(Shore) | D-92 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | 2000 |
| Tg(°C) | 110 |
| CTE(Below Tg)10-6/°C | 28 |
| Service Temp.Range | -55°C to 175°C |
| Thermal Conductivity(W/m°K) | 0.5 |
| Volume Resistivity(500 V) | 1 x 10^15 |
Recommended Applications
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