EB-350-4T-FL is one component, flexible, thixotropic, thermally conductive epoxy adhesive recommended for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards. This adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.
EB-350-4T-FL bonds readily to itself and to metals, silica, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a wide temperature range.
|Mix Ratio by Weight|
|Mixed Viscosity @RT(cps)||>800,000|
|Pot Life @25°C(100 gram)||30|
|Recommended Cure||1 hr/100°C+1 hr/150°C|
|Alternate Cure||30 min/150°C|
|Lap Shear Strength @25°C(psi)||2600|
|Service Temp.Range||-55°C to 220°C|
|Volume Resistivity(500 V)||6 x 10^15|
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