One component. Jpg 2


EB-350-4T-FL is one component, flexible, thixotropic, thermally conductive epoxy adhesive recommended for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards. This adhesive develops strong, durable, high impact bonds at room temperature which improve heat transfer while maintaining electrical insulation.

EB-350-4T-FL bonds readily to itself and to metals, silica, alumina, sapphire and other ceramics, glass, plastics and many other materials, because its coefficient of thermal expansion provides a good match for those materials over a wide temperature range.

Product Specifications

No.of Components 1
Mix Ratio by Weight
Mixed Viscosity @RT(cps) >800,000
Pot Life @25°C(100 gram) 30
Recommended Cure 1 hr/100°C+1 hr/150°C
Alternate Cure 30 min/150°C
Color Black
Specific Gravity 2.1
Hardness(Shore) D-90
Refractive Index NA
Lap Shear Strength @25°C(psi) 2600
Tg(°C) 110
CTE(Below Tg)10-6/°C 58
Service Temp.Range -55°C to 220°C
Thermal Conductivity(W/m°K) 1.8
Volume Resistivity(500 V) 6 x 10^15

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