Epoxies, silicone, urethanes and many other polymer adhesives have a documented and stated viscosity which is an indicator of how “thick” or “thin” the material. While viscosity is a bit more complex than that, it is still a good way to gauge whether the material will flow properly for your application. There are a few different ways of reducing viscosity in the field or on the production floor. The easiest way is to add a small amount of heat. Because viscosity is heat dependent, heating the material lowers viscosity. Heat also affects the work life so that must be taken into account when deciding. Another option is adding solvents or diluents to the epoxy such as MEK or high flash naphtha. Please contact Epoxyset before adding to make sure the solvent or diluent is compatible with the product.
EB-350-1LV-M2 is a low viscosity, general purpose one component epoxy. EB-350-1LV-M2 is used commonly for a variety of applications including potting, encapsulating, underfill, and dielectric layering. With a room temperature viscosity of about 25,000cps, it is ideal for automated dispensing as well as manual use. EB-350-1LV-M2 can be heat slightly to reduce viscosity and is compatible with certain solvents. Epoxyset also offers reactive diluents (non-solvent) which can also reduce the viscosity. Specific uses for this product include potting small electronic components such as capacitors and transistors.
|Mix Ratio by Weight||NA|
|Mixed Viscosity @RT(cps)||5000-15,000 - 30,000|
|Pot Life @25°C(100 gram)||3 months|
|Recommended Cure||1 hr @ 100°C + 1 hr @ 150°C|
|Alternate Cure||30 min @ 150°C|
|Lap Shear Strength @25°C(psi)||2900|
|Service Temp.Range||-55°C to 175°C|
|Volume Resistivity(500 V)||>10^15|
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