EB-350-3LV is a standard, one component, glob top encapsulating compound. The concept of glob top epoxy is simple; a drop of “glob” or resin used as an encapsulation of semiconductor chip, dies, and wires. Epoxyset has glob tops specially formulated for rheology, cure profile, and other properties. Glob top epoxies need to flow over the entire area but not spread out too much that is runs off the die or chip.

EB-350-3LV is a widely used glob top epoxy used in semiconductors and PCBs. EB-350-3LV is specially formulated for rheological control and has low shrinkage reducing stress on delicate components. Used by OEM all over the world, EB-350-3LV can also be used in ferrite core bonding, and die attach. EB-350-3LV is flame retardant and does not use any bromine or any other halogens.

Product Specifications

No.of Components 1
Mix Ratio by Weight NA
Mixed Viscosity @RT(cps) 55,000-65,000
Pot Life @25°C(100 gram) 3 months
Recommended Cure 1hr@100°C+1hr@150°C
Alternate Cure 1 hr@125°C
Color Black
Specific Gravity 1.56
Hardness(Shore) D-91
Refractive Index NA
Lap Shear Strength @25°C(psi) >3500
Tg(°C) 130
CTE(Below Tg)10-6/°C 45
Service Temp.Range -55°C to 220°C
Thermal Conductivity(W/m°K) 0.4
Volume Resistivity(500 V) 6x1015

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