Epoxy systems such as DP-460 or Loctite E-60HP as common room temperature cure epoxy adhesives designed to satisfy a wide range of applications. But what can’t epoxy adhesives like that do? They do not perform well above temperatures of 120°C (250°F). The adhesive becomes soft and begins to lose tensile properties. For that, you need specially formulated epoxy systems for high-temperature resistance.
EB-112LV-2 is an epoxy adhesive and potting compound designed for superior performance above 200°C (392°F). EB-112LV-2 also has excellent corrosion resistance and is commonly used a chemically resistant coating. EB-112LV-2 is used in potting high-powered transformers as well as fiber termination into ferrules. In semiconductor applications, EB-112LV-2 is a capillary flow underfill for flip chip mount die. In the electronics industry, EB-112LV-2 is excellent for coil impregnation of copper coil windings.
|Mix Ratio by Weight||100/30|
|Mixed Viscosity @RT(cps)||150-300|
|Pot Life @25°C(100 gram)||>8 hrs|
|Recommended Cure||2 hrs @ 100°C|
|Alternate Cure||30 min @ 65°C + 1 hr @ 150°C|
|Lap Shear Strength @25°C(psi)||2100|
|Service Temp.Range||-55°C to 200°C|
|Volume Resistivity(500 V)||2 x 10^16|
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