The cost of thermal materials is very dependent on the type of filler, the amount of filler, and the other unique qualities of the adhesive. While there several low cost, thermally conductive adhesives available from Epoxyset, certain unique, high performance adhesives may cost more but also deliver much more. EB-403-1-ALAN is a unique, high performance adhesive incorporating a blend of highly conductive fillers.
EB-403-1-ALAN is been specially formulated to have extremely high conductivity while still being cost efficient. Adding multiple fillers and using multiple sized particles, EB-403-1-ALAN of 2.4 W/mK. EB-403-1-ALAN is used anywhere requiring high heat transfer including PCB flex bonding, LED heat sinks, and drum core bonding.
|Mix Ratio by Weight||NA|
|Mixed Viscosity @RT(cps)||>800,000|
|Pot Life @25°C(100 gram)||3 months|
|Recommended Cure||1 hr @ 100°C + 1 hr @ 150°C|
|Alternate Cure||30min @ 150°C|
|Lap Shear Strength @25°C(psi)||2620|
|Service Temp.Range||-55°C to 230°C|
|Volume Resistivity(500 V)||>1x1015|
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