How to attach heat sinks


EB-470 is a thermally conductive, high temperature epoxy adhesive specially designed for heat sink attachment. In electronics, heat sinks are passive heat exchangers that cool a device by dissipating heat into the surrounding medium. In computers, heat sinks are used to cool CPUs and graphics cards. In optoelectronics such as lasers and LEDs, heat sinks are used to moderate operating temperature.

EB-470 is a thermally conductive adhesive used improve the heat sink’s performance by filling air gaps between the heat sink and the device. EB-470 can be screen printed, machine dispensed, stamped, or manually applied. It has a very long work life of over 6 hours and cures within minutes at temperatures above 150°C.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100/10
Mixed Viscosity @RT(cps) 5,000 - 8,000
Pot Life @25°C(100 gram) >48 hrs
Recommended Cure 5-10min @150°C
Alternate Cure 1min @ 175°C
Color Grey
Specific Gravity 1.9
Hardness(Shore) D-86
Refractive Index NA
Lap Shear Strength @25°C(psi) 2000
Tg(°C) 98
CTE(Below Tg)10-6/°C 28
Service Temp.Range -55°C to 250°C
Thermal Conductivity(W/m°K) 1.0
Volume Resistivity(500 V) 6.0 x 10^15

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