EC-1006M-4
FLEXIBLE THERMALLY CONDUCTIVE POTTING COMPOUND
EC-1006M-4
EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.
UL File No: E198161 under “Plastic – Components” for 94V0 Flame Retardant
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100:12 |
| Mixed Viscosity @RT(cps) | 4000 |
| Pot Life @25°C(100 gram) | 5-6 hours |
| Recommended Cure | 1-2 hours @ 100°C |
| Alternate Cure | 24 hours @ 25°C |
| Color | Black |
| Specific Gravity | 1.62 |
| Hardness(Shore) | A-85 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | NA |
| Tg(°C) | 28 |
| CTE(Below Tg)10-6/°C | NA |
| Service Temp.Range | -55°C - 120°C |
| Thermal Conductivity(W/m°K) | 0.8 |
| Volume Resistivity(500 V) | 1 x 10^14 |
Recommended Applications
- Potting capacitors, transistors, and other power supply and transmission components.
- Coil Impregnation
- Motor/Stator Potting
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