EC-1009
THERMALLY CONDUCTIVE POTTING COMPOUND
EC-1009
EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100:10 |
| Mixed Viscosity @RT(cps) | 3,000-5,000 |
| Pot Life @25°C(100 gram) | 3 hours |
| Recommended Cure | 3 hrs @ 65°C |
| Alternate Cure | 24 hours @ 25°C |
| Color | Black |
| Specific Gravity | 1.9 |
| Hardness(Shore) | D-89 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | NA |
| Tg(°C) | 70 |
| CTE(Below Tg)10-6/°C | 34 |
| Service Temp.Range | -55°C - 155°C |
| Thermal Conductivity(W/m°K) | 1.6 |
| Volume Resistivity(500 V) | 3.0 x 10^15 |
Recommended Applications
Potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.
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