EC-1009

THERMALLY CONDUCTIVE POTTING COMPOUND

EC-1009

EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc

Product Specifications

No.of Components 2
Mix Ratio by Weight 100:10
Mixed Viscosity @RT(cps) 3,000-5,000
Pot Life @25°C(100 gram) 3 hours
Recommended Cure 3 hrs @ 65°C
Alternate Cure 24 hours @ 25°C
Color Black
Specific Gravity 1.9
Hardness(Shore) D-89
Refractive Index NA
Lap Shear Strength @25°C(psi) NA
Tg(°C) 70
CTE(Below Tg)10-6/°C 34
Service Temp.Range -55°C - 155°C
Thermal Conductivity(W/m°K) 1.6
Volume Resistivity(500 V) 3.0 x 10^15

Recommended Applications

Potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

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