EC-1015
THERMAL POTTING COMPOUND
EC-1015
EC-1015 is a low viscosity, thermal potting compound exhibiting excellent electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100:25 |
| Mixed Viscosity @RT(cps) | 3,000-5,000 |
| Pot Life @25°C(100 gram) | 8 hours |
| Recommended Cure | 2 hrs @ 70°C + 2 hrs @ 150°C |
| Alternate Cure | 4 hours @ 100°C |
| Color | Black |
| Specific Gravity | 1.95 |
| Hardness(Shore) | D-92 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | NA |
| Tg(°C) | 145 |
| CTE(Below Tg)10-6/°C | 34 |
| Service Temp.Range | -55°C - 180°C |
| Thermal Conductivity(W/m°K) | 1.2 |
| Volume Resistivity(500 V) | 1 x 10^16 |
Recommended Applications
- Excellent performance in densely packaged power supplies
- Integrated circuits
- Thick film hybrid devices
- D/A converters
- Oscillators
- Amplifiers
- Relays
- Transformers and semiconductors etc.
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