EC-1015LV-RT

THERMALLY CONDUCTIVE POTTING COMPOUND

EC-1015LV-RT

EC-1015LV-RT is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It offers the excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices it distributes heat evenly throughout the casting, providing greater efficiency and longer working life. It is useful for potting and encapsulating densely packaged power supplies, integrated circuits, thick film hybrid devices, D/A converters, oscillators, amplifiers, relays, transformers and semiconductors etc.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100:10
Mixed Viscosity @RT(cps) 2,000-3,000
Pot Life @25°C(100 gram) 40-60 min
Recommended Cure 24 hours @ 25°C
Alternate Cure 2 hours @ 70°C
Color Black
Specific Gravity 2.1
Hardness(Shore) D-92
Refractive Index NA
Lap Shear Strength @25°C(psi) NA
Tg(°C) 67
CTE(Below Tg)10-6/°C 34
Service Temp.Range -55°C - 130°C
Thermal Conductivity(W/m°K) 1.4
Volume Resistivity(500 V) 1 x 10^15

Recommended Applications

Potting and encapsulating densely packaged power supplies, integrated circuits, thick film hybrid devices, D/A converters, oscillators, amplifiers, relays, transformers and semiconductors etc.

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