Epoxy Potting Compound


EC-1190 is an epoxy encapsulating system with a very low density for use in the aerospace and medical industries. EC-1190 is low viscosity and can cure at room temperature when used with catalyst EH-21. EC-1190 has excellent chemical resistance and a low coefficient of thermal expansion (CTE).

Product Specifications

No.of Components 2
Mix Ratio by Weight 100:10 (with EH-21)
Mixed Viscosity @RT(cps) 2,000-3,000
Pot Life @25°C(100 gram) 1-2 hours
Recommended Cure 3 hrs @ 65°C
Alternate Cure 24 hours @ 25°C
Color Charcoal
Specific Gravity 0.74
Hardness(Shore) D-86
Refractive Index NA
Lap Shear Strength @25°C(psi) NA
Tg(°C) 60
CTE(Below Tg)10-6/°C 45
Service Temp.Range -55°C - 130°C
Thermal Conductivity(W/m°K) NA
Volume Resistivity(500 V) 1 x 10^13

Recommended Applications

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