EC-1190
Epoxy Potting Compound
EC-1190
EPOXICAST EC-1190 encapsulant is recommended for applications where high compressive stress is applied to encapsulated circuitry – as in deep ocean work. This product will have a minimum effect on electronic circuit operation and shows negligible deformation and water absorption. EC-1190 is a light weight, syntactic foam epoxy potting compound with a low dielectric constant and high compression strength.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100:10 (with EH-21) |
| Mixed Viscosity @RT(cps) | 2,000-3,000 |
| Pot Life @25°C(100 gram) | 1-2 hours |
| Recommended Cure | 3 hrs @ 65°C |
| Alternate Cure | 24 hours @ 25°C |
| Color | Charcoal |
| Specific Gravity | 0.74 |
| Hardness(Shore) | D-86 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | NA |
| Tg(°C) | 60 |
| CTE(Below Tg)10-6/°C | 45 |
| Service Temp.Range | -55°C - 130°C |
| Thermal Conductivity(W/m°K) | NA |
| Volume Resistivity(500 V) | 1 x 10^13 |
Recommended Applications
EPOXICAST EC-1190 encapsulant is recommended for applications where high compressive stress is applied to encapsulated circuitry – as in deep ocean work. This product will have a minimum effect on electronic circuit operation and shows negligible deformation and water absorption.
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