Epoxy Potting Compound


EC-1207 is a two-part, ambient temperature-cure, epoxy potting and encapsulating system. This semi-rigid system has excellent shock & vibration resistance and good thermal conductivity. It meets UL-94 V-0 requirements. This low viscosity with a convenient mix ratio of 1:1 by volume is specifically designed for submersible pumps, and also can be used for low to medium voltage electrical potting applications such as ballast, starters, electronic timers etc.

Product Specifications

No.of Components 2
Mix Ratio by Weight 100:100
Mixed Viscosity @RT(cps) 9,000 - 12,000
Pot Life @25°C(100 gram) 2-3 hours
Recommended Cure 2 hours @ 65°C
Alternate Cure 24 hours @ 25°C
Color Black
Specific Gravity 1.55
Hardness(Shore) D-76
Refractive Index NA
Lap Shear Strength @25°C(psi) NA
Tg(°C) 55
CTE(Below Tg)10-6/°C 42
Service Temp.Range -55°C - 125°C
Thermal Conductivity(W/m°K) 0.75
Volume Resistivity(500 V) 3.0 x 10^14

Recommended Applications

  • Powder Module Potting
  • Capacitors, transformers, RF filters
  • Battery Packs
  • When UL-94V-0 is required

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