EO-30M-1 is one of Epoxyset’s most used electrically conductive epoxy. It is a room temperature cure and an attractive option for components that cannot withstand temperatures of heat cure epoxies. Although room temperature cure epoxy is a widely used option, care must be taken with silver filled materials. Temperature fluctuation can play a significant role in cure speed and cross-link density. Effects on cross-link density change the conductivity and resistivity of the material. Humidity is also important to control as increased humidity leads to amine curing agents to migrate to the surface resulting in uncured material and an improper mix ratio. Improper mix ratios can severely affect the polymer in its mechanical strength, outgassing, and conductive ability.
EO-30M-1 has been specially formulated to help reduce the risk of environmental fluctuation on the cured material. While it does not eliminate the risk, EO-30M-1 is less sensitive to temperature variability to its cured properties. EO-30M-1 can cure in 24 hours at temperatures as low at 20°C and can obviously be cured using heat as well. EO-30M-1 is an ideal product for solderless electronic components as well as thermal interface management. It can be used for die bonding onto ceramic PCB as well as LED arrays (or single LEDs) onto a PCB.
|Mix Ratio by Weight||100/100|
|Mixed Viscosity @RT(cps)||Paste|
|Pot Life @25°C(100 gram)||1 hr|
|Recommended Cure||2 hrs @ 70°C|
|Alternate Cure||24-48 hrs @ 25°C|
|Lap Shear Strength @25°C(psi)||1700|
|Service Temp.Range||-55°C to 120°C|
|Volume Resistivity(500 V)||0.002|
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