EO-84M-1HTK is one part, silver filled, high electrical & thermal conductivity, epoxy adhesive for die attach, semiconductor and other microelectronics applications.

EO-84M-1HTK is designed for bonding a variety of bare semiconductor devices to a lead frame or substrate. It may also be suitable as a solder replacement or other applications requiring a snap cure, electrically conductive adhesive.

Product Specifications

No.of Components 1
Mix Ratio by Weight
Mixed Viscosity @RT(cps) 40,000-50,000
Pot Life @25°C(100 gram)
Recommended Cure 1 hour @ 150°C
Alternate Cure 15 minutes @ 175°C
Color Silver
Specific Gravity 3.2
Hardness(Shore) D-90
Refractive Index
Lap Shear Strength @25°C(psi) 1600
Tg(°C) 106
CTE(Below Tg)10-6/°C 53
Service Temp.Range -55°C-200°C
Thermal Conductivity(W/m°K) 10.5
Volume Resistivity(500 V) 0.0003

Features & Applications:

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