EO-84M-1HTK is one part, silver filled, high electrical & thermal conductivity, epoxy adhesive for die attach, semiconductor and other microelectronics applications.
EO-84M-1HTK is designed for bonding a variety of bare semiconductor devices to a lead frame or substrate. It may also be suitable as a solder replacement or other applications requiring a snap cure, electrically conductive adhesive.
|Mix Ratio by Weight|
|Mixed Viscosity @RT(cps)||40,000-50,000|
|Pot Life @25°C(100 gram)|
|Recommended Cure||1 hour @ 150°C|
|Alternate Cure||15 minutes @ 175°C|
|Lap Shear Strength @25°C(psi)||1600|
|Volume Resistivity(500 V)||0.0003|
Features & Applications:
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