SC-454M-6
Thermally Conductive Potting
SC-454M-6
SC-454M-6 is a thermally conductive, low viscosity, condensation cure, RTV silicone potting or encapsulating compound. It is readily pourable and can cure at room temperature. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.
SC-454M-6 is designed for potting and encapsulation of electrical/electronics components that require the dissipation of heat and the high temperature properties and low stress of a silicone compound. The cured material may be knife-cut for replacement of components and new compound may be poured in place and cured to re-form tight seal.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100:4 |
| Mixed Viscosity @RT(cps) | 4,000-6,000 |
| Pot Life @25°C(100 gram) | 30-60 min |
| Recommended Cure | 24 hrs @ 25°C |
| Alternate Cure | |
| Color | Red |
| Specific Gravity | 2.2 |
| Hardness(Shore) | A-70 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | NA |
| Tg(°C) | NA |
| CTE(Below Tg)10-6/°C | 155 |
| Service Temp.Range | -55°C-250°C |
| Thermal Conductivity(W/m°K) | 1.4 |
| Volume Resistivity(500 V) | 6.0 x 10^14 |
Recommended Applications
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