EB-153
Medical Grade Epoxy
EB-153
EB-153 is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100/10 |
| Mixed Viscosity @RT(cps) | 3000-5000 |
| Pot Life @25°C(100 gram) | 5-6 hours |
| Recommended Cure | 1-2 minutes @ 150°C |
| Alternate Cure | 5-10minutes @ 125°C |
| Color | Dark Amber |
| Specific Gravity | 1.18 |
| Hardness(Shore) | D-87 |
| Refractive Index | 1.5694 @589nm |
| Lap Shear Strength @25°C(psi) | 2600 |
| Tg(°C) | >115 |
| CTE(Below Tg)10-6/°C | 54 |
| Service Temp.Range | -55°C to 250°C |
| Thermal Conductivity(W/m°K) | |
| Volume Resistivity(500 V) | >1x10^15 |
Recommended Applications
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Semiconductor: Wafer to wafer bonding; MEMs devices; flip chip underfill
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Hybrid: fiber optic, hermetic seals and high temperature packaging sensors
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Fiber optic: Sealing fiber into ferrules, transmitting light in the optical pathway, Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays
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Medical: Potting fiber optic bundles into ferrules for light guides and endoscopes; Capable of resisting several sterilization techniques; ISO 10993-5 approved for cytotoxicity; adhesive for catheter devices
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Electronics Assembly: Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics; Impregnating.
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