EB-403-1-ALAN
High thermal conductivity epoxy
EB-403-1-ALAN
Thermal conductivity of adhesive systems depends on a number of factors including type and amount of filler, size of fillers, air etc. Many thermally conductive adhesive use one type of filler and one size of filler which adds conductivity but only a little. EB-403-1-ALAN is been specially formulated to have extremely high conductivity while still being cost efficient. Adding multiple fillers and using multiple sized particles, EB-403-1-ALAN of 2.4 W/mK. EB-403-1-ALAN is used anywhere requiring high heat transfer including PCB flex bonding, LED heat sinks, and drum core bonding. EB-403-1-ALAN
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | NA |
| Mixed Viscosity @RT(cps) | >800,000 |
| Pot Life @25°C(100 gram) | 3 months |
| Recommended Cure | 1 hr @ 100°C + 1 hr @ 150°C |
| Alternate Cure | 30min @ 150°C |
| Color | Grey |
| Specific Gravity | 2.1 |
| Hardness(Shore) | D-90 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | 2620 |
| Tg(°C) | 132 |
| CTE(Below Tg)10-6/°C | 38 |
| Service Temp.Range | -55°C to 230°C |
| Thermal Conductivity(W/m°K) | 2.4 |
| Volume Resistivity(500 V) | 1.0 x 10^13 |
Recommended Applications
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