EB-470
How to attach heat sinks
EB-470
EB-470 is a thermally conductive, high temperature epoxy adhesive specially designed for heat sink attachment. In electronics, heat sinks are passive heat exchangers that cool a device by dissipating heat into the surrounding medium. In computers, heat sinks are used to cool CPUs and graphics cards. In optoelectronics such as lasers and LEDs, heat sinks are used to moderate operating temperature.
EB-470 is a thermally conductive adhesive used improve the heat sink’s performance by filling air gaps between the heat sink and the device. EB-470 can be screen printed, machine dispensed, stamped, or manually applied. It has a very long work life of over 6 hours and cures within minutes at temperatures above 150°C.
Product Specifications
| No.of Components | 2 |
| Mix Ratio by Weight | 100/10 |
| Mixed Viscosity @RT(cps) | 5,000 - 8,000 |
| Pot Life @25°C(100 gram) | >48 hrs |
| Recommended Cure | 5-10min @150°C |
| Alternate Cure | 1min @ 175°C |
| Color | Grey |
| Specific Gravity | 1.9 |
| Hardness(Shore) | D-86 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | 2000 |
| Tg(°C) | 98 |
| CTE(Below Tg)10-6/°C | 28 |
| Service Temp.Range | -55°C to 250°C |
| Thermal Conductivity(W/m°K) | 1.0 |
| Volume Resistivity(500 V) | 6.0 x 10^15 |
Recommended Applications
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