EC-1850FT is a pourable filled epoxy resin system offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. It is a lower viscosity version of EC-1850FT. It rapidly transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low shrinkage minimizes risk of damage to fragile components. It is useful for potting and encapsulating densely packaged power supplies and heat generating components, integrated circuits, power and operational amplifiers, transformers and many types of semiconductors.
|Mix Ratio by Weight||100:3.5 (with EH-9)|
|Mixed Viscosity @RT(cps)||50,000-60,000 (with EH-9)|
|Pot Life @25°C(100 gram)||40-60 min|
|Recommended Cure||2 hours @ 70°C|
|Alternate Cure||24 hours @ 25°C|
|Lap Shear Strength @25°C(psi)||2400|
|Service Temp.Range||-40°C - 130°C|
|Volume Resistivity(500 V)||2 x 10^15|
Potting and encapsulating densely packaged power supplies and heat generating components, integrated circuits, power and operational amplifiers, coils, transformers and many types of semiconductors.
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