Ec m3030


EC-M3030 is a medium viscosity epoxy encapsulant designed for encapsulating microcircuit packaging. It has very long work life and can be handled easily at room temperature, cures in a relatively short time at moderate temperature. The use of synthetic fused silica yields alpha particle emissions suitable for memory devices. EC-M3030 can be used to fill a cavity or pot a dam as well as glob top encapsulation. Autoclave performance on live devices is greater than 1,000 hours with no failure. Typical packages EC-M3030 is used on are IC memory cards, hybrid circuits, and BGA and pin grade arrays.

Product Specifications

No.of Components
Mix Ratio by Weight
Mixed Viscosity @RT(cps) 90,000 - 120,000
Pot Life @25°C(100 gram) 24 hrs
Recommended Cure 1hr@100°C + 2 hrs@165°C
Alternate Cure 2hrs @ 150°C
Color Black
Specific Gravity 1.82
Hardness(Shore) D-93
Refractive Index NA
Lap Shear Strength @25°C(psi) 2000
Tg(°C) 158
CTE(Below Tg)10-6/°C 22
Service Temp.Range -55°C to 200°C
Thermal Conductivity(W/m°K) 0.8
Volume Resistivity(500 V) >1015

Use the form below to request additional information & product data