EC-M3030
EC-M3030
EC-M3030 is a medium viscosity epoxy encapsulant designed for encapsulating microcircuit packaging. It has very long work life and can be handled easily at room temperature, cures in a relatively short time at moderate temperature. The use of synthetic fused silica yields alpha particle emissions suitable for memory devices. EC-M3030 can be used to fill a cavity or pot a dam as well as glob top encapsulation. Autoclave performance on live devices is greater than 1,000 hours with no failure. Typical packages EC-M3030 is used on are IC memory cards, hybrid circuits, and BGA and pin grade arrays.
Product Specifications
| No.of Components | |
| Mix Ratio by Weight | |
| Mixed Viscosity @RT(cps) | 90,000 - 120,000 |
| Pot Life @25°C(100 gram) | 24 hrs |
| Recommended Cure | 1hr@100°C + 2 hrs@165°C |
| Alternate Cure | 2hrs @ 150°C |
| Color | Black |
| Specific Gravity | 1.82 |
| Hardness(Shore) | D-93 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | 2000 |
| Tg(°C) | 158 |
| CTE(Below Tg)10-6/°C | 22 |
| Service Temp.Range | -55°C to 200°C |
| Thermal Conductivity(W/m°K) | 0.8 |
| Volume Resistivity(500 V) | >1015 |
Recommended Applications
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