EO-84M-1HTK
HIGH CONDUCTIVITY EPOXY ADHESIVE
EO-84M-1HTK
EO-84M-1HTK is one part, silver filled, high electrical & thermal conductivity, epoxy adhesive for die attach, semiconductor and other microelectronics applications.
EO-84M-1HTK is designed for bonding a variety of bare semiconductor devices to a lead frame or substrate. It may also be suitable as a solder replacement or other applications requiring a snap cure, electrically conductive adhesive.
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | |
| Mixed Viscosity @RT(cps) | 40,000-50,000 |
| Pot Life @25°C(100 gram) | |
| Recommended Cure | 1 hour @ 150°C |
| Alternate Cure | 15 minutes @ 175°C |
| Color | Silver |
| Specific Gravity | 3.2 |
| Hardness(Shore) | D-90 |
| Refractive Index | |
| Lap Shear Strength @25°C(psi) | 1600 |
| Tg(°C) | 106 |
| CTE(Below Tg)10-6/°C | 53 |
| Service Temp.Range | -55°C-200°C |
| Thermal Conductivity(W/m°K) | 10.5 |
| Volume Resistivity(500 V) | 0.0003 |
Features & Applications:
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