EO-98HT
EO-98HT
EO-98HT is used highly in snap curing applications. This highly silver-filled epoxy paste adhesive is solvent free, re-workable, and electrically and thermally conductive. With outstanding strength for bonding materials with highly mismatched CTE’s (i.e. alumina to aluminum, silicon to copper). EO-98HT can be easily reworked at elevated temperatures (80 to 100 °C) and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE’s. Both viscosity and thixotropic index makes it screen printable, automated, or dispensed manually. EO-98HT is available in various size syringes for automatic needle dispensing applications or in bulk sized jars.
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | NA |
| Mixed Viscosity @RT(cps) | 35,000-55,000 |
| Pot Life @25°C(100 gram) | 1 month |
| Recommended Cure | 5 min @ 150°C |
| Alternate Cure | 30 min @ 125°C |
| Color | Silver |
| Specific Gravity | 3.50 |
| Hardness(Shore) | D-85 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | >1200 |
| Tg(°C) | 136 |
| CTE(Below Tg)10-6/°C | 42 |
| Service Temp.Range | -55°C to 250°C |
| Thermal Conductivity(W/m°K) | 1.8 |
| Volume Resistivity(500 V) |
Recommended Applications
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