EC-M19LV
Epoxy Underfill
EC-M19LV
EPOXICAST™ M19-LV is a highly filled, low stress liquid encapsulant with very good moisture resistance. It is exceptionally fluid and has very long working life at room temperature. M19-LV can be used as a fill epoxy in dam-and-fill applications. The cured system has a low coefficient of thermal expansion, high glass transition temperature, and good dielectric properties.
EPOXICAST™ M19-LV can be used for bare chip protection in a variety of advanced packages such as IC memory cards, chip carriers, hybrid circuits, chip-on-board, multi-chip modules, and pin grid & ball grid arrays.
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | |
| Mixed Viscosity @RT(cps) | 9,000-12,000 |
| Pot Life @25°C(100 gram) | 48 hrs |
| Recommended Cure | 1 hr/100°C + 2 hr/125°C |
| Alternate Cure | 30 min/150°C |
| Color | Black |
| Specific Gravity | 1.82 |
| Hardness(Shore) | D-92 |
| Refractive Index | |
| Lap Shear Strength @25°C(psi) | |
| Tg(°C) | 145 |
| CTE(Below Tg)10-6/°C | 26 |
| Service Temp.Range | 55°C-180°C |
| Thermal Conductivity(W/m°K) | NA |
| Volume Resistivity(500 V) | 2x10^16 |
Applications & Features
- Underfill
- Fill (for Dam & Fill encapsulation)
- Fast Flow
- Snap Cure
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