EC-M3121-RW
REWORKABLE UNDERFILL ENCAPSULANT
EC-M3121-RW
EPOXICAST™ M3121-RW is a reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | |
| Mixed Viscosity @RT(cps) | 900-1300 |
| Pot Life @25°C(100 gram) | 7 days |
| Recommended Cure | 10 min @ 130°C |
| Alternate Cure | 3-5 min @ 175°C |
| Color | Amber |
| Specific Gravity | 1.13 |
| Hardness(Shore) | D-72 |
| Refractive Index | |
| Lap Shear Strength @25°C(psi) | 1500 |
| Tg(°C) | 80 |
| CTE(Below Tg)10-6/°C | 56 |
| Service Temp.Range | -55°C-250°C |
| Thermal Conductivity(W/m°K) | NA |
| Volume Resistivity(500 V) | 2 x 10^16 |
Features & Applications:
- One Component
- Stable electrical performance in temperature humidity bias
- Fast cure at moderate temperatures
- Room Temperature Flow Capability
- Compatible with most Pb-free solders
- Long Work Life at Room Temperature
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