EPOXICAST EC-1082 is a low expansion epoxy potting compound formulated to expand and contract less as temperature changes. It is specially formulation to obtain an extremely low CTE and high Tg. It is used to encapsulate and protect components while helping maintain dimensional stability and reduce stress during heating, cooling, and repeated thermal cycling.
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Why is low expansion important?
A potted assembly contains materials such as copper, aluminum, ceramics, glass, and circuit boards. These materials expand at different rates. When the surrounding epoxy expands substantially more than the components, it can place stress on the assembly.
Reducing that mismatch can help:
- Protect fragile components, solder joints, and electrical connections.
- Reduce cracking and separation at bonded interfaces.
- Maintain the position of precision components.
- Improve reliability through repeated temperature cycles.
The goal is to select an epoxy whose expansion is compatible with the assembly. The lowest CTE alone does not guarantee the lowest stress; stiffness, flexibility, geometry, and cure shrinkage also matter.
EC-1082 is used in assemblies where temperature changes could damage components or affect accuracy, including:
- Electronic modules and power supplies: protecting components and connections.
- Transformers, coils, and motor windings: supporting tightly packed assemblies exposed to heating and cooling.
- Sensors and precision instruments: helping preserve component position and calibration.
- Optical, aerospace, and defense assemblies: supporting dimensional stability in demanding operating environments.
