EB-350-1LV-M2
One Component Epoxy
EB-350-1LV-M2
EC-350-1LV-M2 is a one component, room temperature stable glob top, underfill, or general encapsulating compound. It is one of the most versatile products for electronic assembly due to its low CTE, low viscosity, and long shelf life. EB-350-1LV-M2 also snap cures at high temperatures making it optimal for PCB applications. EB-350-1LV-M2 is a reworkable undefill. Reworkable underfills are a great option for low cost, flip chip technology. Removal of defective CSPs and BGAs is easily accomplished by heating the component and underfill to 220°C. Epoxy residues are easily scraped or brushed off.
Product Specifications
| No.of Components | 1 |
| Mix Ratio by Weight | NA |
| Mixed Viscosity @RT(cps) | 15,000 |
| Pot Life @25°C(100 gram) | >3 months |
| Recommended Cure | 2 hrs @ 125°C |
| Alternate Cure | 1 hr @ 150°C |
| Color | Black |
| Specific Gravity | 1.5 |
| Hardness(Shore) | D-91 |
| Refractive Index | NA |
| Lap Shear Strength @25°C(psi) | 2900 |
| Tg(°C) | 120 |
| CTE(Below Tg)10-6/°C | NA |
| Service Temp.Range | -55°C to 175°C |
| Thermal Conductivity(W/m°K) | 0.45 |
| Volume Resistivity(500 V) | >1015 |
Recommended Applications
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