EB-470

What is die shear strength? Die Shear strength is a determination of adhesion of a semiconductor die to the package’s die attaches substrate by subjecting the die to a stress that’s parallel to the plane of die attach substrate, resulting in a shearing stress between the die-die attach material interface and the die attach material-substrate interface. Why is die shear strength important? The general purpose of die shear testing is to assess the over-all quality of the die attach process, including the integrity of the materials and the capabilities of the processes used in mounting the die (and other elements, if any) to the package substrate

EB-470 has been used for years in die attach process of heat sinks, LEDs, lead wires etc. EB-470 has a die shear strength of over 3400psi. EB-470 has a convenient 1:1 mix ratio, is stable at room temperature for over 2 days, and can cure within 5 minutes at 150°C. EB-470 has a thermal conductivity of over 1.0 W/mK and is an ideal alternative to more expensive, silver filled epoxies for low powered heat sinks.