HTG-71
HIGH TEMPERATURE THERMAL GREASE
HTG-71
HTG-71 is a high temperature resistance thermal grease,, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 300°C, maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
This material will not bleed, dry, harden or melt in normal industrial use and provides long-term material stability. It can be used for mounting semiconductor devices, power transistors, and diodes; coupling heat generating assemblies to chassis; heat transfer medium on ballast; thermal joints; and many electronics, automotive and electrical applications.
Product Specifications
No.of Components | 1 |
Mix Ratio by Weight | |
Mixed Viscosity @RT(cps) | |
Pot Life @25°C(100 gram) | |
Recommended Cure | |
Alternate Cure | |
Color | White |
Specific Gravity | 2.9 |
Hardness(Shore) | |
Refractive Index | |
Lap Shear Strength @25°C(psi) | |
Tg(°C) | |
CTE(Below Tg)10-6/°C | |
Service Temp.Range | -40°C - 300°C |
Thermal Conductivity(W/m°K) | 1.0 |
Volume Resistivity(500 V) | 1.1 x 10^14 |
Recommended Applications
Use the form below to request additional information & product data