Category

Electronics

ElectronicsEpoxy AdhesiveUV/LED

Active Alignment Adhesives

What is active alignment? Active alignment refers to the process of fine-tuning or precisely aligning components, typically optical or mechanical systems, while the system is actively operating. This method is commonly used in the manufacturing and assembly of high-precision devices, such as cameras, sensors, and optical instruments. In contrast to "passive alignment," where components are assembled based on predetermined measurements or templates, active alignment adjusts the components in real-time while…
Paven Patel
October 2, 2024
ElectronicsEpoxy Adhesive

Electrically Conductive Epoxy

Electrically conductive epoxy is a type of adhesive that not only bonds materials together but also conducts electricity. It is commonly used in various applications where both mechanical bonding and electrical conductivity are required. Here are some key points about electrically conductive epoxy: Composition and Types 1. Conductive Fillers: These epoxies typically contain conductive fillers such as silver, copper, nickel, or carbon. Silver is the most common due to its…
Paven Patel
June 18, 2024
ElectronicsUV/LED

Advantages of UV Cure Epoxy

Cationic epoxy, more commonly UV cure epoxy, refers to a type of epoxy resin system that cures through a cationic (positively charged) polymerization mechanism. Epoxy resins are polymers widely used in various industrial applications, including adhesives, coatings, and composites, due to their excellent adhesive properties, chemical resistance, and mechanical strength. In a cationic epoxy system, the curing process involves the reaction of epoxy groups (usually present in the resin) with…
Paven Patel
March 27, 2024
Electronicspotting and encapsulating

The Importance of Choosing the Right Electronic Potting Compound

In today’s market, electronic components are subjected to some pretty brutal environments that can drastically diminish the working life of electronic devices. However, manufacturers can take steps to reduce environmental and mechanical exposures by utilizing potting compound and encapsulation methods. Advancements in materials science have led to innovative solutions to protect sensitive electronic components from damage and prolong their life. Electronic potting uses these state-of-the-art materials to create a protective…
Paven Patel
March 8, 2024
ElectronicsEpoxy Adhesive

Electrically Conductive Adhesive: Enabling Technologies in Electronics

If you’ve ever seen the inside of any modern electronic device, you’ll see the inner workings of advanced technologies held together with state-of-the-art adhesives. These adhesives are designed to help maintain the electrical current throughout the device, replacing bulky bonding methods such as solder. As such, electronic manufacturers are able to produce smaller, lighter, and more reliable devices using specially formulated electrically conductive adhesives. How Does an Electrically Conductive Adhesive…
Paven Patel
February 23, 2024
ElectronicsUV/LED

Active Alignment Adhesive: FLASHBOND UV-3720

Epoxyset, a leading manufacturer of epoxy adhesives, introduces its FLASHBOND UV-3720, a light and/or heat-curable cationic epoxy specifically designed for active alignment applications. These include camera modules, optical components, LiDAR (Light Detection and Ranging), and other ADAS (Advanced Driver Assistance Systems) assemblies used in automotive applications. During the optical assembly process of many components need to be positioned exactly and efficiently. Types of assemblies include lenses in cameras, CCD chips,…
Paven Patel
February 21, 2024
Electronics

Flip Chip Die Attach

Flip chip die attach is a technique used in the semiconductor and microelectronics industry for connecting semiconductor chips (known as dies) directly to substrates or carrier packages. In this method, the chip is flipped over and attached facedown onto the substrate or carrier using a conductive adhesive material. This is in contrast to the traditional wire bonding method, where the connections are made by bonding wires from the chip to…
Paven Patel
October 30, 2023
Electronics

Dam and Fill Encapsulation

"Dam and fill" is a technique used in electronics manufacturing and semiconductor packaging to address the challenges of encapsulating delicate components with epoxy resin or other encapsulant materials. In certain electronic devices, there might be components that are placed relatively close to each other on a circuit board or within a semiconductor package. These components can generate heat during operation, and the thermal expansion and contraction rates of different materials…
Paven Patel
August 23, 2023
ElectronicsEpoxy AdhesiveUV/LED

FLASHBOND™ UV-5608DC Light Activated, Delay Cure Epoxy Adhesive

Delay Cure Epoxy Adhesive Epoxyset introduces a ground-breaking, light cure chemistry that allows fast processing and fixturing of parts even if both parts are opaque. This is known as a delay cure epoxy adhesive.  UV-5608DC is one of a series of epoxy adhesives that can be activated by 405nm light with an intensity of about 150mW/cm2 for 5-10 seconds.  Parts are mated together and aligned within 45-60 seconds of activation.…
rob_bdc
August 19, 2019
ElectronicsEpoxy Adhesive

Ferrite Core Bonding – Epoxies, UV Cure Adhesives

Bonding Ferrite Core Halves for Transformers Adhesives have several advantages in joining ferrite halves over mechanical clips. Adhesives help reduce weights as well as help reduce rattle and hum in transformers. Different types of adhesives can be used for this depending on the manufacturer's needs and process. One component epoxies are typical. UV cure adhesives and two-component epoxies are also heavily used for ferrite core bonding. One Part Epoxies One…
rob_bdc
March 13, 2018