potting and encapsulating

Battery Potting and Encapsulation

Utilizing potting and encapsulation compounds in your battery pack design can optimize the performance of your end product. There are three basic types of resins used in this process; these materials are epoxy, urethane, and silicone. These polymeric formulations have excellent adhesion, thermal stability and outstanding chemical resistance. Battery potting and encapsulation compounds are used to provide mechanical reinforcement to housed assemblies, to fill large voids, and to protect components…
Paven Patel
October 31, 2023
Electronics

Flip Chip Die Attach

Flip chip die attach is a technique used in the semiconductor and microelectronics industry for connecting semiconductor chips (known as dies) directly to substrates or carrier packages. In this method, the chip is flipped over and attached facedown onto the substrate or carrier using a conductive adhesive material. This is in contrast to the traditional wire bonding method, where the connections are made by bonding wires from the chip to…
Paven Patel
October 30, 2023
Epoxy Adhesive

Electrically Conductive Adhesives

Silver-filled epoxies are a type of electrically conductive adhesive that contains silver particles or flakes as a filler material within an epoxy resin matrix. These adhesives are designed to provide both electrical conductivity and strong mechanical bonding properties. They are commonly used in various applications, particularly in electronics and microelectronics, where a reliable and electrically conductive bond is required. Electrical conductivity of an adhesive is typically measured by its volume…
Paven Patel
October 6, 2023
Electronics

Dam and Fill Encapsulation

"Dam and fill" is a technique used in electronics manufacturing and semiconductor packaging to address the challenges of encapsulating delicate components with epoxy resin or other encapsulant materials. In certain electronic devices, there might be components that are placed relatively close to each other on a circuit board or within a semiconductor package. These components can generate heat during operation, and the thermal expansion and contraction rates of different materials…
Paven Patel
August 23, 2023
potting and encapsulatingRecent-news

Polyurethane Potting Compounds

Polyurethane potting compounds are a type of thermosetting polymer material commonly used in electronics and electrical applications for encapsulating or potting electronic components. Potting refers to the process of enclosing or embedding components in a protective compound to enhance their durability, protect against environmental factors, and provide electrical insulation. Polyurethane potting compounds are formulated by combining two main components: a polyol resin and an isocyanate hardener. These components react chemically…
Paven Patel
July 7, 2023
potting and encapsulating

Benefits of Epoxy Potting Compounds

Epoxy potting compounds are a type of thermosetting resin system that are widely used for encapsulating or potting electronic components, circuits, and assemblies. They provide protection, insulation, and mechanical support to the encapsulated devices. Here's a breakdown of the key aspects and benefits of epoxy potting compounds: Epoxy Resin: Epoxy resins are the primary component of epoxy potting compounds. These resins are formed by the reaction of epoxy monomers with…
Paven Patel
July 7, 2023
Uncategorized

Premixed and Frozen Adhesives

Premixed and frozen adhesives, sealants, and potting compounds have been in use in the manufacturing industry for over 40 years, primarily in the aerospace and medical device industries. Why has it excelled in those industries? The precision and consistency required when producing parts in the aerospace and medical industries is of the utmost importance. Reducing operator error, waste while also increasing efficiency is the best way for manufacturers in those…
Paven Patel
November 2, 2022
Uncategorized

Light Cure Encapsulating Materials

Encapsulation of chips and modules on PCBs, smart cards, and flex circuits are increasingly prevalent in the ever growing digital and hands-free world. The global smart card market had a value of $10.19 in 2019 and is expected to grow to over $15 billion by 2027. Smart cards are becoming increasingly popular due to its enhanced speed and security. Smart card usage ranges from credit cards, gift cards, government and…
Paven Patel
January 13, 2022
Recent-newsEpoxy AdhesiveUV/LED

FLASHBOND UV-3607HT NOMINATED FOR PRODUCT OF THE YEAR

Epoxyset is proud to announce the nomination of its new UV/Heat cure epoxy, FLASHBOND UV-3607HT for Product of the Year at the Assembly Show 2021 in Rosemont, IL. This is second year (2019) Epoxyset has been nominated for this award. You can read the details from Assembly Show website here. Visit us at Booth 1811 at the Donald E. Stephens Convention Center in Rosemont, IL on Oct. 25-28 to learn…
Paven Patel
October 14, 2021
potting and encapsulating

Coil Impregnation Epoxy

A common application for epoxy potting and encapsulating materials is coil impregnation in electrical transformer manufacturing. Transformer coils are encapsulated for a variety of reasons including: Increase dielectric strength Improve the structural integrity of the coils Reduce or eliminate winding noise Improve heat transfer Reduce partial discharge Provide increased environmental protection Why use epoxy when needing to encapsulate coil windings in transformers? Epoxy potting and encapsulating compounds offer the best…
Paven Patel
October 5, 2020