Electronics

Dam and Fill Encapsulation

"Dam and fill" is a technique used in electronics manufacturing and semiconductor packaging to address the challenges of encapsulating delicate components with epoxy resin or other encapsulant materials. In certain electronic devices, there might be components that are placed relatively close to each other on a circuit board or within a semiconductor package. These components can generate heat during operation, and the thermal expansion and contraction rates of different materials…
Paven Patel
August 23, 2023
potting and encapsulatingRecent-news

Polyurethane Potting Compounds

Polyurethane potting compounds are a type of thermosetting polymer material commonly used in electronics and electrical applications for encapsulating or potting electronic components. Potting refers to the process of enclosing or embedding components in a protective compound to enhance their durability, protect against environmental factors, and provide electrical insulation. Polyurethane potting compounds are formulated by combining two main components: a polyol resin and an isocyanate hardener. These components react chemically…
Paven Patel
July 7, 2023
potting and encapsulating

Benefits of Epoxy Potting Compounds

Epoxy potting compounds are a type of thermosetting resin system that are widely used for encapsulating or potting electronic components, circuits, and assemblies. They provide protection, insulation, and mechanical support to the encapsulated devices. Here's a breakdown of the key aspects and benefits of epoxy potting compounds: Epoxy Resin: Epoxy resins are the primary component of epoxy potting compounds. These resins are formed by the reaction of epoxy monomers with…
Paven Patel
July 7, 2023
Uncategorized

Premixed and Frozen Adhesives

Premixed and frozen adhesives, sealants, and potting compounds have been in use in the manufacturing industry for over 40 years, primarily in the aerospace and medical device industries. Why has it excelled in those industries? The precision and consistency required when producing parts in the aerospace and medical industries is of the utmost importance. Reducing operator error, waste while also increasing efficiency is the best way for manufacturers in those…
Paven Patel
November 2, 2022
Uncategorized

Light Cure Encapsulating Materials

Encapsulation of chips and modules on PCBs, smart cards, and flex circuits are increasingly prevalent in the ever growing digital and hands-free world. The global smart card market had a value of $10.19 in 2019 and is expected to grow to over $15 billion by 2027. Smart cards are becoming increasingly popular due to its enhanced speed and security. Smart card usage ranges from credit cards, gift cards, government and…
Paven Patel
January 13, 2022
Recent-newsEpoxy AdhesiveUV/LED

FLASHBOND UV-3607HT NOMINATED FOR PRODUCT OF THE YEAR

Epoxyset is proud to announce the nomination of its new UV/Heat cure epoxy, FLASHBOND UV-3607HT for Product of the Year at the Assembly Show 2021 in Rosemont, IL. This is second year (2019) Epoxyset has been nominated for this award. You can read the details from Assembly Show website here. Visit us at Booth 1811 at the Donald E. Stephens Convention Center in Rosemont, IL on Oct. 25-28 to learn…
Paven Patel
October 14, 2021
potting and encapsulating

Coil Impregnation Epoxy

A common application for epoxy potting and encapsulating materials is coil impregnation in electrical transformer manufacturing. Transformer coils are encapsulated for a variety of reasons including: Increase dielectric strength Improve the structural integrity of the coils Reduce or eliminate winding noise Improve heat transfer Reduce partial discharge Provide increased environmental protection Why use epoxy when needing to encapsulate coil windings in transformers? Epoxy potting and encapsulating compounds offer the best…
Paven Patel
October 5, 2020
Epoxy AdhesiveFeatured Products

FLASHBOND UV-6502CL – Clear Light Curable Adhesive

CLEAR LIGHT CURABLE ADHESIVE Epoxyset presents FLASHBOND UV-6502CL, a water white clear light curable adhesive for bonding, coating and sealing. Typical applications in for high strength bonding in electronics and opto-electronics industries. UV-6502CL is a very versatile adhesive with many application uses. This low viscosity, light curable adhesive is an epoxy with low cure shrinkage and high clarity. UV-6502CL cures best at 310-380nm wavelengths and will cure in under 6-8…
Paven Patel
June 3, 2020
Epoxy AdhesiveFeatured Products

EPOXIBOND EB-116 – High Strength Epoxy Adhesive

Epoxyset presents EPOXIBOND™ EB-116, a high strength epoxy adhesive for bonding, encapsulating and sealing. Typical applications in for high strength bonding in electronics and opto-electronics industries. EB-116 is one of the most versatile products Epoxyset offers. It is used worldwide as an adhesive, potting and encapsulating system, sealant, and coating. Applications This high strength epoxy adhesive cures to a semi-rigid polymer. Consequently it is excellent for temperature cycling from -55°C…
Paven Patel
May 4, 2020
ElectronicsEpoxy AdhesiveUV/LED

FLASHBOND™ UV-5608DC Light Activated, Delay Cure Epoxy Adhesive

Delay Cure Epoxy Adhesive Epoxyset introduces a ground-breaking, light cure chemistry that allows fast processing and fixturing of parts even if both parts are opaque. This is known as a delay cure epoxy adhesive.  UV-5608DC is one of a series of epoxy adhesives that can be activated by 405nm light with an intensity of about 150mW/cm2 for 5-10 seconds.  Parts are mated together and aligned within 45-60 seconds of activation.…
rob_bdc
August 19, 2019